Detecting structural integrity of a structural component

ABSTRACT

Each of a plurality electronic circuit devices fixed to a structural component of a physical structure can be scanned a first time, using a radio frequency (RF) scanner to receive, from each of the plurality of electronic circuit devices, first data indicating a first measured electrical impedance of a respective conductor connected to the electronic circuit device and an identifier assigned to the electronic circuit device. For each of the plurality of electronic circuit devices, the first data indicating the first measured electrical impedance and the identifier assigned to the electronic circuit device can be stored to a first memory. The first data indicating the first measured electrical impedance and the identifier for each of the electronic devices can form a baseline measurement of the electronic circuit devices.

BACKGROUND

The present invention relates to detecting integrity of structuralmaterials.

Structures typically are designed to function for a desired servicelife. Sometimes, though, structural integrity is prematurelycompromised. Structural integrity may be compromised due to externalcauses, such as earthquakes, fire, overload, impact, chemical exposure,etc. Structural integrity also may be compromised due to improperdesign, manufacturing defects, fatigue, corrosion, and so on.

Throughout history there have been many structural failures that havetaken their toll on human life. One fairly recent example is thecollapse of the I-35 W Mississippi River Bridge (Bridge 9340). Thebridge catastrophically failed during the evening rush hour on Aug. 1,2007, collapsing to the river and riverbanks beneath. Thirteen peoplewere killed and 145 were injured. Another example is the collapse of twosuspended walkways through the lobby of the Hyatt Regency hotel inKansas City, Mo. on Jul. 17, 1981. That collapse took the lives of 114people, and more than 200 people were injured.

SUMMARY

A method includes scanning a first time, using a radio frequency (RF)scanner, each of a plurality electronic circuit devices fixed to astructural component of a physical structure to receive, from each ofthe plurality of electronic circuit devices, first data indicating afirst measured electrical impedance of a respective conductor connectedto the electronic circuit device and an identifier assigned to theelectronic circuit device. The method further includes, for each of theplurality of electronic circuit devices, storing the first dataindicating the first measured electrical impedance and the identifierassigned to the electronic circuit device to a first memory, wherein thefirst data indicating the first measured electrical impedance and theidentifier for each of the electronic devices forms a baselinemeasurement of the electronic circuit devices.

Another method includes, for each of a plurality of electronic circuitdevices, configuring the electronic circuit device to be fixed to astructural component of a physical structure and to, responsive to beingscanned by a radio frequency (RF) scanner, use energy contained in an RFsignal generated by the RF scanner to measure an electrical impedance ofa respective electrical conductor and communicate to the RF scanner dataindicating the measured electrical impedance of the respectiveelectrical conductor. The method also includes, for each of theplurality of electronic circuit devices, connecting the respectiveelectrical conductor to the electronic circuit device, wherein therespective electrical conductor is configured to have a respectiveelectrical impedance that changes in value responsive to the electricalconductor being deformed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating an example architecture of anelectronic circuit device.

FIG. 2 is a block diagram illustrating example architecture of a radiofrequency (RF) scanner.

FIG. 3 is an example of a structural wrap including a plurality ofelectronic circuit devices configured to be scanned by an RF scanner.

FIG. 4 is an example of a structural component of a physical structure,the structural component including a plurality of electronic circuitdevices configured to be scanned by an RF scanner.

FIG. 5 is a flow chart illustrating an example of a method ofconfiguring an electronic circuit device.

FIG. 6 is a flow chart illustrating an example of a method of detectingstructural integrity of a physical structure.

DETAILED DESCRIPTION

This disclosure relates to detecting structural integrity of structuralcomponents. In accordance with the arrangements described herein, eachof a plurality of electronic circuit devices can be configured to befixed to a structural component of physical structure. The electroniccircuit devices also can be configured to, responsive to being scannedby a radio frequency (RF) scanner, use energy contained in an RF signalgenerated by the RF scanner to measure an electrical impedance ofrespective electrical conductors and communicate to the RF scanner dataindicating the measured electrical impedances. Each of the electricalconductors can be configured to have an electrical impedance thatchanges in value responsive to the electrical conductor being deformed,and can be connected to a respective electronic circuit device.

A plurality of the electronic circuit devices, and the respectiveelectrical conductors, can be fixed to a structural component of aphysical structure. By way of example, the electronic circuit devicescan be embedded into the structural component when the structuralcomponent is formed, or attached to the structural component. Theelectronic circuit devices can be attached to the structural componentby embedding the electronic circuit devices in a structural wrap, andattaching the structural wrap to the structural component.

An RF scanner can perform an initial scan of the electronic circuitdevices to receive data indicating the impedance of the respectiveelectrical conductors. Such data can form a baseline measurement.Subsequent scans can be performed to gather additional impedance data,which can be compared to the baseline measurement to determine whetherany of the electrical conductors have deformed or broken. Deformation orbreaking of the electrical conductors can indicate that the structuralintegrity of the structural component has been compromised to someextent, for example due to displacement, cracks, compression,elongation, movement, or the like. Based on data generated by thecomparison, the structural component that has been compromised can beidentified, and further structural inspection of that structuralcomponent may be warranted.

Of course, the above process can be applied to a plurality of otherstructural components of the structure. Responsive to one or morestructural components that have been compromised being identified,rather than performing a complete inspection of the structure,additional structural inspections can focus only on those structuralcomponents, and perhaps other structural components to which thestructural component is attached. The ability provided by the presentarrangements to indicate which structural components have beencompromised, and focusing structural inspections to those areas, cansave much time and money.

Several definitions that apply throughout this document now will bepresented.

As defined herein, the term “electronic circuit device” means a devicethat includes at least one hardware circuit (e.g., an integratedcircuit) and is configured to transmit a radio frequency (RF) signal inwhich data is encoded to an RF scanner responsive to being scanned bythe RF scanner.

As defined herein, the term “radio frequency scanner,” also referred toherein as “RF scanner,” means a system or device configured to detect aradio frequency signal generated by at least one electronic circuitdevice and identify information encoded in the radio frequency signal.

As defined herein, the term “fix” means to place or attach. A device isfixed to a structural component by embedding the device within thestructural component or attaching the device to the structuralcomponent. By way of example, a device may be attached to a structuralcomponent by embedding the device in a material, such as a structuralwrap, and attaching the material to the structural component.

As defined herein, the term “impedance” means the total opposition thatan electrical conductor or device presents to a flow of electricalcurrent when a voltage is applied to the electrical conductor or device.For example, an impedance can be determined by determining a ratio of amaximum voltage to a maximum alternating current or direct current. Animpedance may be expressed in complex notation that includes a realvalue and an imaginary value indicating a relationship of a phase of analternating voltage to a phase of an alternating current, for exampledue to a combination of resistance, capacitance, inductance, reluctance,etc., though this need not be the case. For instance, in one aspect, animpedance measured using direct voltage/current may be expressed as anelectrical resistance (e.g., an impedance with zero phase angle).

As defined herein, the term “impedance meter” means a meter configuredto measure an impedance of an electrical conductor or device. An“impedance meter” may express a measured impedance as a value indicatingresistance or using complex notation (e.g., a real value indicatingresistance and an imaginary value indicating phase).

As defined herein, the term “structural wrap” means a flexible materialconfigured to be attached to a physical structure.

As defined here, the term “data indicating a measured electricalimpedance” means a value of the measured electrical impedance, or avalue of a ratio determined by comparing the value of the measuredelectrical impedance to a value of a reference electrical impedancemeasurement.

As defined herein, the term “memory element” means a physical memorystructure that contains or stores data for use by or in connection witha system, apparatus, or device. As defined herein, a “memory element” isnot a transitory, propagating signal per se.

As defined herein, the term “responsive to” means responding or reactingreadily to an action or event. Thus, if a second action is performed“responsive to” a first action, there is a causal relationship betweenan occurrence of the first action and an occurrence of the secondaction, and the term “responsive to” indicates such causal relationship.

As defined herein, the term “processor” means at least one hardwarecircuit (e.g., an integrated circuit) configured to carry outinstructions contained in program code. Examples of a processor include,but are not limited to, a central processing unit (CPU), an arrayprocessor, a vector processor, a digital signal processor (DSP), afield-programmable gate array (FPGA), a programmable logic array (PLA),an application specific integrated circuit (ASIC), programmable logiccircuitry, and a controller.

As defined herein, the term “real time” means a level of processingresponsiveness that a user or system senses as sufficiently immediatefor a particular process or determination to be made, or that enablesthe processor to keep up with some external process.

As defined herein, the term “output” means storing in memory elements,writing to display or other peripheral output device, sending ortransmitting to another system, exporting, or the like.

As defined herein, the term “user” means a person (i.e., a human being).

FIG. 1 is a block diagram illustrating an example architecture of anelectronic circuit device (hereinafter “device”) 100. The device 100 canbe configured to, responsive to being scanned by a radio frequency (RF)scanner, measure an electrical impedance of an electrical conductor 140and communicate to the RF scanner data at least indicating the measuredelectrical impedance of the electrical conductor and/or a ratio of theelectrical impedance to an impedance of a reference electricalconductor. In one non-limiting example, the electronic circuit device100 can be a passive radio frequency identifier (RFID) tag configured inaccordance with the arrangements described herein.

The device 100 can include at least one antenna 110, at least onecapacitor 112, a power supply 114, a decoder 116, an encoder 118, atransmission controller 120, memory elements 122 and an impedance meter124. Optionally, in lieu of having the decoder 116 separate from theencoder 118, the device 100 can include an encoder/decoder. One or moreof the components 110-122 of the device 100 can be embodied in anintegrated circuit (IC), for example an IC chip. In one non-limitingarrangement, the device 100 can be encased in a protective material, forexample a plastic casing.

The antenna 110 can be configured to receive radio frequency (RF)signals generated by an RF scanner, as well as transmit RF signals tothe RF scanner. The device 100 also can include a capacitor 112 whichmay store, at least temporarily, electrical energy contained in RFsignals received from the RF scanner and provide the electrical energyto the power supply 114. The power supply 114 can use the electricalenergy to generate a voltage, and regulate the voltage, as is well knownto those of ordinary skill in the art. For example, the power supply 114can include a rectifier that rectifies the RF signal to generate avoltage (e.g., a DC voltage). Optionally, the power supply 114 also mayinclude a power inverter that generates an AC voltage from the DCvoltage. The power supply 114 also can include one or more voltageregulators that regulate the amplitude the AC voltage and/or DC voltage.

The power supply 114 can distribute the voltage(s) to various componentsof the device 100, including the decoder 116, encoder 118, transmissioncontroller 120, memory elements 122 and impedance meter 124 to provideelectricity for operation. For example, the power supply 114 candistribute DC voltage to the components 116-124. In one arrangement, theimpedance meter 124 can use the DC voltage to measure the impedance ofthe electrical conductor 140. In another arrangement, the power supply114 also can distribute AC voltage to the impedance meter 124, and theimpedance meter 124 can use the AC voltage to measure the impedance ofthe electrical conductor 140.

The decoder 116 can decode data carried in an RF signal received fromthe RF scanner by the antenna 110 and communicate such data to thetransmission controller 120. For example, the decoder 116 can demodulatethe RF signal into a baseband signal and process the baseband signal todetect the data contained therein. Demodulation of the RF signal intothe baseband signal may include first converting the RF signal to anintermediate frequency (IF), though the present arrangements are notlimited in this regard.

The encoder 118 can encode data received from the transmissioncontroller 120 into an RF signal, which can be transmitted to the RFscanner by the antenna 110. For example, the encoder 118 can generate abaseband signal that includes the data, and modulate the basebandsignals into an RF signal, which also is well known to those of ordinaryskill in the art. Modulation of the baseband signal into the RF signalmay include first modulating the baseband signal to an intermediatefrequency (IF), though the present arrangements are not limited in thisregard. In one arrangement, the device 100 can include a switch 126operable by the transmission controller 120 and/or the encoder 118 toclose when the encoder 118 generates the outbound RF signal.

The transmission controller 120 can process the data received from thedecoder 116 and, in response, initiate the device 100 to perform one ormore processes, as will be described. The transmission controller 120also can select data to communicate the encoder 118 for transmission tothe RF scanner, as also will be described.

The memory elements 122 can include random access memory (RAM), staticrandom access memory (SRAM), ferroelectric random access memory(Fe-RAM), read-only memory (ROM), erasable programmable read-only memory(EPROM or Flash memory) and/or the like. The memory elements 122 canstore a unique identifier assigned to the device 100, for example aRFID. The memory elements 122 also can store executable program codeconfigured to be executed by the transmission controller 120 and/orimpedance meter 124 to perform various operations described herein.Further, the memory elements 122 can store, at least temporarily,impedance measurements and/or impedance ratios, which will be described.

The impedance meter 124 can be configured to measure the impedance of anelectrical conductor 140. In illustration, the device 100 can include atleast two ports 130, 132 to which respective ends 142, 144 of theelectrical conductor 140 (e.g., a wire) may be connected to form aconductive loop. In a simple example, the ports 130, 132 can beelectrical connectors conductively linked to the impedance meter 124. Inone arrangement, the electrical conductor 140 can be an insulatedelectrical conductor. In another arrangement, the electrical conductor140 can be a non-insulated electrical conductor. Optionally, the device100 can include additional ports (not shown) to which one or moreadditional electrical conductors (not shown) may be attached, and theimpedance meter 124 also can measure the impedance of the additionalelectrical conductor(s).

The electrical conductor 140 can be any desired length. In this regard,the electrical conductor 140 depicted in FIG. 1 need not be to scale.Indeed, it is anticipated that in some arrangements the length of theelectrical conductor may be significantly longer than any particulardimension of the device 100. In illustration, the device 100 can have alength and width in the range of 1 mm to 25 mm, and the electricalconductor 140 can have a length in the range of 5 mm to 100 m, dependingon the application in which the device will be used.

The electrical conductor 140 can be made of a conductive material or asemi-conductive material. In one arrangement, the conductive material orsemi-conductive material can be malleable and can have an electricalimpedance that changes in response to the electrical conductor 140 beingdeformed. In another arrangement, the conductive material orsemi-conductive material can be inflexible.

In one arrangement, the conductive material or a semi-conductivematerial can predominantly include one element. In another arrangement,the conductive material or a semi-conductive material can include two ormore elements, for example an alloy or other type of material includingtwo or more elements. Examples of elements that may form the electricalconductor 140 include, but are not limited to, copper, aluminum, silver,gold, tungsten, magnesium, nickel, carbon, tin, lead, platinum,titanium, silicon, germanium, etc.

If the electrical conductor 140 is broken, or stretched to the point ofbreaking, the electrical impedance of the electrical conductor 140 canbe infinite, or at least very high since a material in which theconductor is embedded may provide some amount of conductivity. In anarrangement in which the electrical conductor 140 is at least partiallymalleable, if the electrical conductor 140 is stretched, its length willbecome longer and a diameter of at least a portion of the electricalconductor may become smaller, resulting in the electrical impedance ofthe electrical conductor 140 increasing in comparison to the impedanceof electrical conductor 140 prior to being stretched. This can beunderstood by the following equation:

$R = \frac{\rho\; L}{A}$where R is the resistance of the electrical conductor 140, ρ isresistivity of the electrical conductor 140, L is the length of theelectrical conductor 140 and A is the cross sectional area of theelectrical conductor 140.

As will be described, the impedance meter 124 can measure the impedanceof the electrical conductor 140 at various times, and the respectivemeasurements can be compared to determine whether the electricalconductor has deformed. Assuming the electrical conductor 140 has notbeen broken, when the electrical conductor deforms, the change inimpedance may be quite small, but still be detectable by the impedancemeter 124. To ensure accuracy of the impedance measurements made by theimpedance meter 124, the power supply 114 can be configured to, whensupplying voltage to the impedance meter 124, maintain that voltage veryprecisely, for example within 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%,0.8%, 0.9%, 1.0%, etc. of a desired voltage value. In anotherarrangement, the impedance meter 124 can include circuitry to enable theimpedance meter 124 to make very precise impedance measurements, even ifthe voltage provided by the power supply 114 varies beyond a desiredtolerance.

In yet another arrangement, the device 100 can include a referenceelectrical conductor 150 coupled to the impedance meter 124. In additionto measuring the impedance of the electrical conductor 140, theimpedance meter 124 can measure the impedance of the referenceelectrical conductor 150 to generate a reference impedance measurement.The reference impedance measurement can be made when the impedance ofthe electrical conductor 140 is measured, or within a short period oftime (e.g., less than 10 ms, 20 ms, 30 ms, 40 ms, 50 ms, 60 ms, 70 ms,80 ms, 90 ms, 100 ms, or the like) from the impedance of the electricalconductor 140 being measured. The impedance meter 124 can compare theimpedance measurement for the electrical conductor 140 to the referenceimpedance measurement to determine a ratio of the impedance of theelectrical conductor 140 to the reference impedance measurement, andgenerate corresponding data indicating the ratio. The ratio can indicatethe measured impedance of the electrical conductor 140 since the ratiois based on a comparison of the impedance measurement for the electricalconductor 140 to the reference impedance measurement. Thus, the dataindicating the ratio is an indicator of the measured impedance.

Since the impedance measurements are made at the same time, or within ashort period of time from one another, the voltage applied by theimpedance meter 124 can be considered to be constant for each of theimpedance measurements. Accordingly, the ratio of the impedance of theelectrical conductor 140 to the impedance of the reference electricalconductor 150 will not be affected by the actual voltage applied to makethe impedance measurements. Hence, the power supply 114 need notmaintain a voltage regulation tolerance as precisely as previouslydescribed.

In operation, the antenna 110 can receive an RF signal from an RFscanner. In response, the power supply 114 can generate a voltage anddistribute the voltage to various components 116-124 of the device 100as previously described. As noted, the decoder 116 can decode datacarried in the RF signal and communicate such data to the transmissioncontroller 120. In response, the transmission controller 120 can processthe data and initiate one or more processes performed by the device 100.For example, the transmission controller 120 can initiate the impedancemeter 124 to measure the impedance of the electrical conductor 140 andgenerate an impedance measurement value. The impedance meter 124 canstore the impedance measurement value to the memory elements 122. Theimpedance measurement value can be persisted to the memory elements 122or stored temporarily to the memory elements 122. In an arrangement inwhich the impedance measurement value is persisted to the memoryelements 122, the memory elements can be configured to maintain inmemory the impedance measurement value, even after the power supply 114ceases providing voltage to the memory elements 122. The memory elementscan store the impedance measurement value in a functional datastructure, for example a data table, or in one or more memory blocks ordata registers.

In an arrangement in which the device 100 includes the referenceelectrical conductor 150, the impedance meter 124 also can measure theimpedance of the reference electrical conductor 150. Further, theimpedance meter 124 can compare the measured impedance of the electricalconductor 140 to the measured impedance of the reference electricalconductor 150 to determine a ratio of the measured impedance of theelectrical conductor 140 to the measured impedance of the referenceelectrical conductor 150. In one arrangement, the ratio can be a valuedetermined by dividing the value of the measured impedance of theelectrical conductor 140 by the value of the measured impedance of thereference electrical conductor 150. In another arrangement, the ratiocan be a value determined by dividing the value of the measuredimpedance of the reference electrical conductor 150 by the value of themeasured impedance of the electrical conductor 140. The ratio can bepersisted to the memory elements 122 or stored temporarily to the memoryelements 122.

As will be described, the above process can be performed at varioustimes. In one aspect of the present arrangements, the memory elements122 can maintain a plurality of impedance measurements and/or ratios. Inthis regard, each time the device 100 is scanned by an RF scanner, theRF signal can include date/time stamp data. At least one impedancemeasurement and/or ratio determined by the impedance meter 124 can forma baseline measurement of the device 100, and can be indicated in thememory elements 122 as such. The baseline measurement can be determinedprior to, or after, the device 100 being fixed to a physical structure.For example, the baseline measurement can be determined by a first scanperformed by an RF scanner after the device 100 is fixed to a physicalstructure.

The impedance meter 124 and/or transmission controller 120 can store thedate/time stamp data with the impedance measurement value and/or ratiovalue determined in response to receiving the RF signal. Accordingly,values for impedance measurements and/or ratios from various scans canbe retrieved from the memory elements 122 and compared to determinewhether the impedance of the electrical conductor changes over time orbreaks in a time period between successive scans. The date/time stampcan be useful in determining when such changes occur or when the breakoccurs.

Responsive to the impedance meter 124 measuring the impedance of theelectrical conductor 140 and/or determining the ratio, the transmissioncontroller 120 can retrieve the impedance measurement value and/or ratiovalue from the memory elements 122 or receive such value directly fromthe impedance meter 124. The transmission controller 120 can communicatedata including the value to the encoder 118. The encoder 118 can encodethe data into an RF signal, and communicate the RF signal to the RFscanner via the antenna 110.

In an arrangement in which the memory elements 122 store impedancemeasurement values and/or ratio values from previous RF scans, thetransmission controller 120 also can communicate corresponding data,including respective time/date stamps, to the encoder 118. The encoder118 can include the corresponding data in the outbound RF signal.Accordingly, the RF scanner can receive not only data corresponding thepresent impedance measurement and/or ratio, but also data correspondingto previous impedance measurements and/or ratios.

In one aspect of the present arrangements, the device 100 can includeone or more additional sensors and/or meters. Such sensors and/or meterscan be configured to measure temperature, moisture, humidity, pressure,light, acceleration and/or the like. Such sensors and/or meters, or thetransmission controller 120, can store corresponding data to the memoryelements 122. Further, the transmission controller 120 communicate suchdata to the RF scanner using the encoder 118 and antenna 110, forexample as previously described.

In one aspect of the present arrangements, the impedance meter 124 canprocess the temperature, moisture and/or humidity data to normalizeelectrical impedance value measured for the electrical conductor 140prior to storing the impedance value or prior to the transmissioncontroller 120 transmitting the data to the RF scanner. The impedancemeter 124 also can normalize the electrical impedance value measured forthe reference electrical conductor 150 prior to performing thecomparison operations previously described. For example, the measuredimpedance of an uninsulated electrical conductor may be impacted by themoisture content of a material in which the electrical conductor isembedded since the material may also provide a level of electricalconductivity. Further, the conductivity of an electrical conductor maybe dependent, in part, on the temperature of the electrical conductor.The impedance meter 124 can normalize the electrical impedance and/orratio measurements to account for such factors. Also, acceleration datacan indicate whether the electronic circuit devices have been exposed tomovement, for example due to an earthquake, tornado, hurricane, etc.,which may have compromised the structural integrity of a structuralcomponent to which, or in which, the device 100 is attached.

At this point it should be noted that the above processes performed bythe device 100 can be performed in real time. Indeed, the device 100 cangenerate the outbound RF signal carrying the above described data, whichis generated in response to receiving the inbound RF signal from the RFscanner, within milliseconds of receiving the inbound RF signal.Accordingly, the RF scanner to very rapidly scan a large number ofelectronic circuit devices, each of which are configured as describedabove.

FIG. 2 is a block diagram illustrating example architecture of a RFscanner 200. In one non-limiting example, the RF scanner 200 can be anRFID reader (or RFID interrogator) configured in accordance with thearrangements described herein. The RF scanner 200 can be configured toscan a plurality of electronic circuit devices, including the device 100of FIG. 1. The RF scanner 200 can be configured to scan upwards of 400electronic circuit devices per second. To scan the electronic circuitdevices, the RF scanner 200 can generate one or more RF signals andreceive RF signals generated by the electronic circuit devices inresponse to the RF signals generated by the RF scanner 200.

The RF scanner can include a receive antenna 210, a transmit antenna212, a power supply 214, a decoder 216, an encoder 218, a transmissioncontroller 220, a processor 222, memory elements 224, a system interfacecontroller 226 and a communication port 228 (or antenna) and,optionally, a display 230. Optionally, in lieu of having separatereceive and transmit antennas, the RF scanner can include an antennaused for transmit and receive of RF signals. The RF scanner 200 also caninclude user interface (not shown) via which a user interacts with theRF scanner 200 via the display 230 (e.g., if the display 230 is atouchscreen) and/or one or more buttons, keys and/or the like (notshown). One or more of the components 210-226 of the RF scanner 200 canbe embodied in an integrated circuit (IC), for example an IC chip.

The power supply 214 can receive electrical energy from one or morebatteries, or from a power outlet via a power cord. The power supply candistribute voltage to the various components of the RF scanner 200,including the decoder 216, encoder 218, transmission controller 220,processor 222, memory elements 224, system interface controller 226 and,optionally, the display 230.

The antenna 210 can be configured to receive radio frequency (RF)signals generated by the plurality of electronic circuit devices. Thedecoder 216 can decode data carried in an RF signals received from theelectronic circuit devices and communicate such data to the transmissioncontroller 220. For example, the decoder 216 can demodulate the RFsignal into a baseband signal and process the baseband signal to detectthe data contained therein. Demodulation of the RF signal into thebaseband signal may include first converting the RF signal to anintermediate frequency (IF), though the present arrangements are notlimited in this regard.

The encoder 218 can encode data received from the transmissioncontroller 220 into an RF signal, which can be transmitted to theelectronic circuit devices by the antenna 212. For example, the encoder218 can generate a baseband signal that includes the data, and modulatethe baseband signals into an RF signal, which also is well known tothose of ordinary skill in the art. Modulation of the baseband signalinto the RF signal may include first modulating the baseband signal toan intermediate frequency (IF), though the present arrangements are notlimited in this regard. In one arrangement, the RF scanner 200 caninclude a switch 232 operable by the transmission controller 220 and/orthe encoder 218 to close when the encoder 218 generates the outbound RFsignal.

The transmission controller 220 can process the data received from thedecoder 216 and, in response, communicate the data to the processor 222.The transmission controller 220 also can receive data from the processor222 and communicate the data to the encoder 118 for transmission to theplurality of electronic circuit devices using the encoder 218 andantenna 212.

The processor 222 can execute program code to perform one or moreprocesses, as will be described. The processor 222 can access theprogram code from the memory elements 224. The processor 222 also canaccess data from the memory elements 224 that is to be transmitted tothe plurality of electronic circuit devices, and communicate the data tothe transmission controller 220 to be transmitted to the electroniccircuit devices. Further, the processor 222 can receive from thetransmission controller 220 data received from the plurality ofelectronic circuit devices. In response to receiving such data, theprocessor 222 can implement one or more processes, as will be described.

The memory elements 224 can include one or more physical memory devicessuch as, for example, local memory and one or more bulk storage devices.Local memory refers to random access memory (RAM) or othernon-persistent memory device(s) generally used during actual executionof the program code. The bulk storage device(s) can be implemented as ahard disk drive (HDD), solid state drive (SSD), EPROM or Flash memory,or other persistent data storage device. The RF scanner 200 also caninclude one or more cache memories (not shown) that provide temporarystorage of at least some program code in order to reduce the number oftimes program code must be retrieved from the bulk storage device duringexecution.

The system interface controller 226 can interface the RF scanner 200(e.g., the transmission controller 220 and/or processor 222) with one ormore other devices or systems via the communication port 228 (orantenna). For example, the system interface controller 226 can auniversal serial interface (USB) controller, an IEEE-1394 (FireWire™)controller, a Thunderbolt™ controller, a Bluetooth® controller, a Wi-Fi™controller, an Ethernet controller, or the like.

In operation, the RF scanner 200 can be placed or held in proximity toone or more of the plurality of electronic circuit devices (e.g., thedevice 100 of FIG. 1). For example, the RF scanner 200 can be placed orheld within 1 m, 2 m, 3 m, 4 m or 5 m of at least one electronic circuitdevice. The processor 222 can initiate the transmission controller 220to transmit an RF signal to the electronic circuit device(s) aspreviously described. In one arrangement, the processor 222 cancommunicate to the transmission controller 220 data indicating adate/time stamp to be encoded into the RF signal, which the electroniccircuit device(s) can process as previously described.

Responsive to receiving the RF signal from the RF scanner 200, one ormore of the electronic circuit devices can transmit to the RF scanner200 another RF signal. The RF signal received from a particularelectronic circuit device can indicate an RFID of the electronic circuitdevice and a value of a present impedance measurement of a respectiveelectrical conductor and/or a value indicating ratio of the value of theimpedance measurement to the impedance measurement of a respectivereference electrical conductor 150. The RF signal can be received by theRF scanner 200 as previously described, and the transmission controller220 can communicate to the processor 222 the data contained in RFsignal. As noted, in one arrangement the received RF signal also caninclude data pertaining to previous impedance measurements and/orratios, and respective time/date stamps. The transmission controller 220also can communicate such data to the processor 222. The processor 222can store the received data to the memory elements, for example in afunctional data structure (e.g., one or more data tables or the like).The processor 222 also can communicate the data to another device orsystem via the system interface controller 226 and the communicationport 228 (or antenna) to cause the other device or system to store thedata to a functional data structure in one or more memory elementsremote to the RF scanner 200.

In one arrangement, the processor 222 can, for each electronic circuitdevice, compare the value of the present measured impedance and/or ratioto values of one or more previously measured impedances and/or ratios.The previously measured impedances and/or ratios can be identified asbaseline measurements of the respective electronic circuit devices. Inthe case that the values of the previously measured impedances and/orratios are not contained in the RF signals received from the respectiveelectronic circuit devices, the values of the previously measuredimpedances and/or ratios can be accessed from the memory elements 224 orfrom another device or system via the system interface controller 226and the communication port 228 (or antenna). In illustration, each timethe RF scanner 200 scans the respective electronic circuit devices, theRF scanner 200 can store the data, including the values, RFIDs andtime/date stamps, to the memory elements 224, or another device orsystem can store that data to one or more function data structures inmemory elements remote to the RF scanner 200. Such other device orsystem can make that data available to the RF scanner 200, or one ormore other RF scanners, for later comparisons.

Responsive to the processor 222 determining that the present measuredimpedance value and/or ratio value received from at least one of theelectronic circuit devices is not within a specified tolerance of one ormore previously measured impedance values and/or ratio values receivedfrom the electronic circuit device, the processor 222 can output dataindicating such circumstance. For example, the processor 222 can writeto the display 230 information indicating each of the electronic circuitdevices for which the impedance values and/or ratio values have changedby more than the specified tolerance. In another example, theinformation written to the display 230 can indicate the RFID of eachelectronic circuit device, and the impedance values and/or ratio valuesfor the present RF scan and one or more previous RF scans, and visuallyindicate on the display 230 the RFIDs of electronic circuit devices forwhich the values have changed by more than the specified tolerance.

Accordingly, the RF scanner 200 can visually indicate on the display 230which electronic circuit devices are connected to electrical conductorswhich have been deformed or have been broken. This can indicate that thestructural integrity of a structural component of a structure to which,or in which, the electronic circuit devices and electrical conductorsare fixed has been compromised, and the extent to which the structuralintegrity has been compromised. Such structural components may becompromised due to displacement, cracks, compression, elongation,movement, or the like. The RF scanner 200 also can communicatecorresponding information to another device or system, which can storethe information to memory elements for review and/or output to one ormore other displays, printers and/or the like.

In another arrangement, the above comparison and notification processcan be performed by another device or system that accesses the datagathered and communicated by the RF scanner 200, and perhaps datagathered and communicated by another RF scanner. By way of example,another RF scanner can be used to gather data from the plurality ofelectronic circuit devices at a first time and communicate the data tomemory elements accessible by the other device or system. At anothertime the RF scanner 200 can gather data from the plurality of electroniccircuit devices and communicate the data to the memory elementsaccessible by the other device or system. The other device or system canperform the above described comparisons to identify which electroniccircuit devices are connected to electrical conductors which have beendeformed or have been broken. The other device or system also can storethe information to memory elements for review and/or output to one ormore other displays, printers and/or the like.

The RF scanner 200 also can visually indicate on the display 230 otherdata received from the electronic circuit devices, for example datarelating to temperature, moisture, humidity, pressure, light,acceleration and/or the like measured by the electronic circuit devices.The RF scanner 200 also can store such data to the memory elements 224and/or communicate such data to another device or system. In one aspectof the present arrangements, the processor 222, or another device orsystem, can process the temperature, moisture and/or humidity data tonormalize electrical impedance and/or ratio measurements prior toperforming the comparison operations, for example as previouslydescribed.

FIG. 3 is an example of a structural wrap 300 configured to be attachedto a physical structure, for example one or more structural componentsof the physical structure. The structural wrap 300 can be used tomonitor the structural integrity of one or more components of a physicalstructure. For example, a plurality of structural wraps 300 can be fixedto various respective structural components of the physical structure.Each structural wrap 300 can be used to identify, responsive to bescanned an RF scanner 340, a respective structural component that isstructurally compromised to some extent, and the extent to which thestructural members are compromised.

The structural wrap 300 can include a planar material 310. The planarmaterial 310 can be a plastic material, for example, a polyestersheeting, Tyvek®, or another flexible material. In one arrangement, theplanar material 310 can have a thickness 315 of 50 μm to 100 mm, thoughthe present arrangements are not limited in this regard. Optionally, anadhesive 320 can be applied to at least one side of the planar material310 to facilitate attaching the structural wrap 300 to a physicalstructure. In other arrangements one or more fasteners and/or bands canbe used to attach the structural wrap 300 to a physical structure.

A plurality of electronic circuit devices 330, each of which may beconfigured according to the description of the electronic circuit device100 of FIG. 1, can be embedded in the planar material 310, along withone or more respective electrical conductors (not shown for simplicity)according the description of the electrical conductor 140 of FIG. 1. Assuch, the plurality of electronic circuit devices 330 can be configuredto be scanned by an RF scanner 340, which can configured according tothe description of the RF scanner 200 of FIG. 2. The structural wrap 300can be attached to a physical structure. For example, the structuralwrap 300 can be wrapped around a structural column of the physicalstructure, applied to a side, floor, ceiling or wall of a physicalstructure, or the like.

After the structural wrap 300 can be attached to a structural componentof the physical structure, the RF scanner 340 can perform an initialscan of the plurality of electronic circuit devices 330 to form baselinemeasurements of the electronic circuit devices 330. The baselinemeasurement for each electronic circuit device 330 can include an RFIDof the electronic circuit device 330 and at least one value of theelectrical impedances of the respective electrical conductor(s)connected to the electronic circuit device 330 and/or ratio(s)previously described. In illustration, the RF scanner 340 can transmitRF signals received by the plurality of electronic circuit devices 330,and receive RF signals transmitted by the plurality of electroniccircuit devices 330 in response to receiving the RF signals. Responsiveto receiving the RF signals, the RF scanner 340 can receive, store andprocess data contained in the RF signals as previously described.Further, the RF scanner 340 can communicate the data to another deviceor system for processing, also as previously described. In onenon-limiting arrangement, the initial scan may be correlated with atraditional inspection (e.g., X-ray inspection, Gamma ray inspection,etc.) to ensure that the structural component is sound to begin with inorder to provide suitable baseline measurements.

One or more of the electronic circuit devices 330 may be inactive ordefective, for example due to manufacturing defects, damage when beingembedded into the structural wrap 300, or damage to the structural wrap300 either during handling or application of the structural wrap 300 tothe physical structure. The RF scanner 340 will not receive data frominactive electronic circuit devices 330, but may receive erroneous datafrom defective electronic circuit devices 330. Nonetheless, the RFscanner 340 can identify such erroneous data and identify the RFIDs ofelectronic circuit devices 330 producing the erroneous data in order toindicate that further data from such electronic circuit devices 330 isto be ignored when determining structural integrity.

In one aspect of the present arrangements, the RF scanner 340 candetermine a location of each of the respective electronic circuitdevices 330 and generate corresponding data. The corresponding data maybe stored to memory elements within the RF scanner 340 and/or to memoryelements in one or more other devices or systems communicatively linkedto the RF scanner 340. To determine the location of the respectiveelectronic circuit devices 330, the RF scanner 340 can include a globalpositioning receiver (not shown in FIG. 2) that determines a presentlocation of the RF scanner 340. Further, based on processing dataindicating time delays between transmitting RF signals and receiving RFsignals from a particular electronic circuit device 330, the RF scanner340 can estimate a location of the electronic circuit device 330 withrespect to the RF scanner 340. In this regard, a normal time delaybetween an electronic circuit device 330 receiving an RF signal whenscanned by the RF scanner 340 and responding to the RF signal with anoutbound RF signal can be known and indicated by corresponding data, andthus variations in the time delay can be used to determine the locationof the electronic circuit device 330.

In another aspect of the present arrangements, a user of the RF scanner340 can, via a user interface of the RF scanner 340, indicate a presentlocation of the RF scanner 340, which can indicate a present location ofthe respective electronic circuit devices 330. In yet another aspect ofthe present arrangements, the RF scanner 340 can be fixed to, or fixedto a location proximate to, the physical structure. When the RF scanner340 is fixed the physical structure or the location proximate to thephysical structure, the location of the RF scanner 340 can be determinedby a user or an automated process. Nonetheless, the location of the RFscanner 340 can indicate the location of the respective electroniccircuit devices 330 to which the RF scanner 340 is able to transmit andreceive RF signals.

At some time after the initial scan of the electronic circuit devices330, the RF scanner 340 or another RF scanner can scan the electroniccircuit devices 330 to receive data from the electronic circuit devices330 as previously described. For each electronic circuit device 330, theRF scanner 340 performing the scan, or another device or system, cancompare the received data to the baseline measurement of respectiveelectronic circuit device 330. Based on the comparison, a determinationcan be made as to whether an electrical impedance measurement and/orratio indicated in the received data is within a specified tolerance ofa baseline measurement (e.g., baseline electrical impedance and/orratio).

Responsive to identifying, for one or more of the electronic circuitdevices 330, an electrical impedance measurement and/or ratio that isnot within a specified tolerance of a baseline measurement, the RFscanner 340 performing the scan, or another device or system, can outputdata indicating such, as previously described. Such data can indicatethe variation of the present electrical impedance measurement and/orratio to the baseline measurement, thus indicating the extent to whichthe structural component to which the electronic circuit devices 330 arefixed is compromised. For example, a minor variation in the electricalimpedance measurement and/or ratio (e.g., due to a small or moderateamount of deformation of the electrical conductor) can indicate a smallcrack or displacement in the structural component. A major variation inthe electrical impedance measurement and/or ratio (e.g., due tosignificant stretching or breaking of the electrical conductor) canindicate a large crack or displacement in the structural component. Thedata also can indicate the location of the subject electronic circuitdevices 330 and, therefore, indicate the specific structural componentfor which the structural integrity is compromised to some extent.Responsive to a user or processing system analyzing the data, the useror processing system may determine that additional inspection of thestructural component is warranted.

In one non-limiting example, the RF scanner 340 can be permanentlyplaced proximate to the structural wrap 300, for example within 1 m, 2m, 3 m, 4 m or 5 m of the structural wrap, and configured to,automatically, periodically or continually scan the electronic circuitdevices 330. Thus, the RF scanner 340, or another device or system towhich the RF scanner 340 is communicatively linked, can determine, inreal time, whether and when structural integrity of the structuralcomponent to which the structural wrap 300 is attached is compromised.The RF scanner 340 can be communicatively linked to a remote device orsystem via one or more communication networks. A communication networkis a medium used to provide communications links between various devicesand data processing systems connected together within a networkenvironment. The communication network may include connections, such aswire, wireless communication links, or fiber optic cables Thecommunication network can be implemented as, or include, any of avariety of different communication technologies such as a WAN, a LAN, awireless network, a mobile network, a Virtual Private Network (VPN), theInternet, the Public Switched Telephone Network (PSTN), or the like.

FIG. 4 is an example of a structural component 400 of a physicalstructure. The physical structure can include a plurality of suchstructural components 400. A plurality of electronic circuit devices410, each of which may be configured according to the description of theelectronic circuit device 100 of FIG. 1, can be embedded in eachstructural component 400, along with respective electrical conductors(not shown for simplicity) according the description of the electricalconductor 140 of FIG. 1. As such, the plurality of electronic circuitdevices 410 can be configured to be scanned by an RF scanner 420, suchas an RF scanner configured according to the description of the RFscanner 200 of FIG. 2.

In one example, the structural component 400 can be an aggregate bondedwith a fluid, such as concrete, bricks, etc. In another example, thestructural component can be drywall, plaster, or the like. Still, thestructural component 400 can be implemented as any other type ofstructural component, and the present arrangements are not limited inthis regard. In an arrangement in which the structural component 400includes an aggregate bonded with a fluid to form a composite material,the electronic circuit devices 410 and respective electrical conductorscan be embedded in the wet composite material just before, or during,the pouring of the composite material. Any number of electronic circuitdevices 410 may be mixed into the composite material, at any depth asdesired or required by the application.

After the structural component 400 is in place in the physicalstructure, the RF scanner 420 can perform an initial scan the pluralityof electronic circuit devices 410 to form baseline measurements of theelectronic circuit devices 410. The baseline measurement for eachelectronic circuit device 410 can include an RFID of the electroniccircuit device 410 and at least one value of the electrical impedancesof the respective electrical conductor(s) connected to the electroniccircuit device 410 and/or ratio(s) previously described. As noted, oneor more electronic circuit devices 410 may be inactive or defective, andthe RF scanner 420 can ignore data produced by inactive or defectiveelectronic circuit devices 410. In one non-limiting arrangement, theinitial scan may be correlated with a traditional inspection (e.g.,X-ray inspection, Gamma ray inspection, etc.) to ensure that thestructural component 400 is sound to begin with in order to providesuitable baseline measurements.

The RF scanner 420 can perform operations previously described withrespect to FIGS. 2 and 3, including performing subsequent scans, todetermine whether the structural integrity of the structural component400 is compromised. One or more additional RF scanners and/or otherdevices or systems also can perform operations previously described withrespect to FIGS. 2 and 3 to determine whether the structural integrityof the structural component 400 is compromised. For example, responsiveto identifying, for one or more of the electronic circuit devices 410,an electrical impedance measurement and/or ratio that is not within aspecified tolerance of a baseline measurement, the RF scanner 420performing the scan, or another device or system, can output dataindicating such, as previously described.

In one non-limiting example, the RF scanner 420 can be permanentlyplaced proximate to the structural component 400, for example within 1m, 2 m, 3 m, 4 m or 5 m of the structural component, and configured to,automatically, periodically or continually scan the electronic circuitdevices 410 and implement the various processes described with respectto FIG. 3, for example to communicate data to a remote device or system.

FIG. 5 is a flow chart illustrating an example of a method 500 ofconfiguring an electronic circuit device, such as the device 100 ofFIG. 1. At step 502, the electronic circuit device can be configured tobe fixed to a structural component of a physical structure. Further, theelectronic circuit device can be configured to, responsive to beingscanned by a radio frequency (RF) scanner, use energy contained in an RFsignal generated by the RF scanner to measure an electrical impedance ofa respective electrical conductor and communicate to the RF scanner dataindicating the measured electrical impedance of the respectiveelectrical conductor. At step 504, the respective electrical conductorcan be connected to the electronic circuit device. The respectiveelectrical conductor can be configured to have a respective electricalimpedance that changes in value responsive to the electrical conductorbeing deformed.

FIG. 6 is a flow chart illustrating an example of a method 600 ofdetecting structural integrity of a physical structure, for exampleusing a plurality of electronic circuit devices configured as describedwith respect to FIGS. 1 and 5.

At step 602, the plurality of electronic circuit devices can be fixedto, or within, a structural component of a physical structure. At step604, each of the plurality electronic circuit devices can be scanned afirst time, using an RF scanner, to receive, from each of the pluralityof electronic circuit devices, first data indicating a first measuredelectrical impedance of the respective conductor and an identifierassigned to the electronic circuit device. At step 606, for each of theplurality of electronic circuit devices, the first data indicating thefirst measured electrical impedance and the identifier assigned to theelectronic circuit device can be stored to a first memory, wherein thefirst data indicating the first measured electrical impedance and theidentifier for each of the electronic devices forms a baselinemeasurement of the electronic circuit devices. The first data indicatingthe first measured electrical impedance can be a value of the firstmeasured electrical impedance, or a value of a first ratio valuedetermined by comparing a value of the first measured electricalimpedance to a value generated by a first reference electrical impedancemeasurement.

At step 608, each of the plurality electronic circuit devices can bescanned a second time that is later than the first time, using the RFscanner or another RF scanner, each of the plurality electronic circuitdevices to receive, from each of the plurality of electronic circuitdevices, second data indicating a second measured electrical impedanceof the respective conductor and the identifier assigned to theelectronic circuit device. At step 610, for each of the plurality ofelectronic circuit devices, the second data indicating the secondmeasured electrical impedance can be stored to the first memory or asecond memory. The second data indicating the second measured electricalimpedance can be a value of the second measured electrical impedance, ora value of a second ratio determined by comparing a value of the secondmeasured electrical impedance to a value generated by a second referenceelectrical impedance measurement.

At step 612, for each of the electronic circuit devices, the second dataindicating the second measured electrical impedance can be compared tothe first data indicating the first electrical impedance. At step 614,responsive to determining that the second data indicating the secondmeasured electrical impedance is not within a specified tolerance of thefirst data indicating the first electrical impedance for at least one ofthe plurality of electronic circuit devices, data indicating thatelectronic circuit device and the second measured electrical impedanceis not within the specified tolerance of the first electrical impedancecan be output.

While the disclosure concludes with claims defining novel features, itis believed that the various features described herein will be betterunderstood from a consideration of the description in conjunction withthe drawings. The process(es), machine(s), manufacture(s) and anyvariations thereof described within this disclosure are provided forpurposes of illustration. Any specific structural and functional detailsdescribed are not to be interpreted as limiting, but merely as a basisfor the claims and as a representative basis for teaching one skilled inthe art to variously employ the features described in virtually anyappropriately detailed structure. Further, the terms and phrases usedwithin this disclosure are not intended to be limiting, but rather toprovide an understandable description of the features described.

For purposes of simplicity and clarity of illustration, elements shownin the figures have not necessarily been drawn to scale. For example,the dimensions of some of the elements may be exaggerated relative toother elements for clarity. Further, where considered appropriate,reference numbers are repeated among the figures to indicatecorresponding, analogous, or like features.

The present invention may be a device, a system, a method, and/or acomputer program product. The computer program product may include acomputer readable storage medium (or media) having computer readableprogram instructions thereon for causing a processor to carry outaspects of the present invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, or either source code or object code written in anycombination of one or more programming languages, including an objectoriented programming language such as Smalltalk, C++ or the like, andconventional procedural programming languages, such as the “C”programming language or similar programming languages. The computerreadable program instructions may execute entirely on the user'scomputer, partly on the user's computer, as a stand-alone softwarepackage, partly on the user's computer and partly on a remote computeror entirely on the remote computer or server. In the latter scenario,the remote computer may be connected to the user's computer through anytype of network, including a local area network (LAN) or a wide areanetwork (WAN), or the connection may be made to an external computer(for example, through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example,programmable logic circuitry, field-programmable gate arrays (FPGA), orprogrammable logic arrays (PLA) may execute the computer readableprogram instructions by utilizing state information of the computerreadable program instructions to personalize the electronic circuitry,in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof devices, systems, methods, and computer program products according tovarious embodiments of the present invention. In this regard, each blockin the flowchart or block diagrams may represent a module, segment, orportion of instructions, which comprises one or more executableinstructions for implementing the specified logical function(s). In somealternative implementations, the functions noted in the block may occurout of the order noted in the figures. For example, two blocks shown insuccession may, in fact, be executed substantially concurrently, or theblocks may sometimes be executed in the reverse order, depending uponthe functionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “includes,”“including,” “comprises,” and/or “comprising,” when used in thisdisclosure, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Reference throughout this disclosure to “one embodiment,” “anembodiment,” “an arrangement” or similar language means that aparticular feature, structure, or characteristic described in connectionwith the embodiment is included in at least one embodiment describedwithin this disclosure. Thus, appearances of the phrases “in oneembodiment,” “in an embodiment,” “in one arrangement” and similarlanguage throughout this disclosure may, but do not necessarily, allrefer to the same embodiment.

The term “plurality,” as used herein, is defined as two or more thantwo. The term “another,” as used herein, is defined as at least a secondor more. The term “coupled,” as used herein, is defined as connected,whether directly without any intervening elements or indirectly with oneor more intervening elements, unless otherwise indicated. Two elementsalso can be coupled mechanically, electrically, or communicativelylinked through a communication channel, pathway, network, or system. Theterm “and/or” as used herein refers to and encompasses any and allpossible combinations of one or more of the associated listed items. Itwill also be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms, as these terms are only used to distinguishone element from another unless stated otherwise or the contextindicates otherwise.

The term “if” may be construed to mean “when” or “upon” or “in responseto determining” or “in response to detecting,” depending on the context.Similarly, the phrase “if it is determined” or “if [a stated conditionor event] is detected” may be construed to mean “upon determining” or“in response to determining” or “upon detecting [the stated condition orevent]” or “in response to detecting [the stated condition or event],”depending on the context.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. A method comprising: scanning a first time, usinga radio frequency (RF) scanner, each of a plurality electronic circuitdevices fixed to a structural component of a physical structure toreceive, from each of the plurality of electronic circuit devices, firstdata indicating a first measured electrical impedance of a respectiveconductor connected to the electronic circuit device and an identifierassigned to the electronic circuit device; and for each of the pluralityof electronic circuit devices, storing the first data indicating thefirst measured electrical impedance and the identifier assigned to theelectronic circuit device to a first memory, wherein the first dataindicating the first measured electrical impedance and the identifierfor each of the electronic devices forms a baseline measurement of theelectronic circuit devices to which impedance data gathered fromsubsequent scans of the electronic devices is compared to determinewhether any of the conductors of the electronic circuit devices havedeformed or broken.
 2. The method of claim 1, wherein: each of theplurality of electronic circuit devices and the respective electricalconductors are embedded into a structural wrap, wherein the structuralwrap is configured to be attached to the physical structure; and thestructural wrap is attached to the structural component of the physicalstructure.
 3. The method of claim 1, wherein: each of the plurality ofelectronic circuit devices and the respective electrical conductors areembedded into at least one structural material from which the at leastone structural component of the physical structure is made.
 4. A methodcomprising: for each of a plurality of electronic circuit devices:configuring the electronic circuit device to be fixed to a structuralcomponent of a physical structure and to, responsive to being scanned bya radio frequency (RF) scanner, use energy contained in an RF signalgenerated by the RF scanner to measure an electrical impedance of arespective electrical conductor and communicate to the RF scanner dataindicating the measured electrical impedance of the respectiveelectrical conductor, wherein impedance data gathered from a subsequentscan of the electronic circuit device is compared to the measuredelectrical impedance of the respective electrical conductor to determinewhether the respective electrical conductor has deformed or broken; andconnecting the respective electrical conductor to the electronic circuitdevice, wherein the respective electrical conductor is configured tohave a respective electrical impedance that changes in value responsiveto the electrical conductor being deformed.
 5. The method of claim 4,wherein each of the plurality of electronic circuit devices and therespective electrical conductors are fixed to, or fixed within, thestructural component of the physical structure, the method furthercomprising: scanning a first time, using the RF scanner, each of theplurality electronic circuit devices to receive, from each of theplurality of electronic circuit devices, first data indicating a firstmeasured electrical impedance of the respective conductor and anidentifier assigned to the electronic circuit device; and for each ofthe plurality of electronic circuit devices, storing the first dataindicating the first measured electrical impedance and the identifierassigned to the electronic circuit device to a first memory, wherein thefirst data indicating the first measured electrical impedance and theidentifier for each of the electronic devices forms a baselinemeasurement of the electronic circuit devices.
 6. The method of claim 4,further comprising: embedding each of the plurality of electroniccircuit devices and the respective electrical conductors into astructural wrap, wherein the structural wrap is configured to beattached to the physical structure.
 7. The method of claim 6, furthercomprising: attaching the structural wrap to the physical structure. 8.The method of claim 4, further comprising: embedding each of theplurality of electronic circuit devices and the respective electricalconductors into at least one structural material from which the at leastone structural component of the physical structure is made.